SEMPAC Inc. - Open-Pak� Innovative Solutions In Packaging


SEMPAC Innovative Solutions In Packaging

News & Press

SEMPAC Announcing Newly Developed Plastic Lid
06-29-2007
SEMPAC Inc.

SEMPAC will be announcing their newly developed “Plastic Lid” which will further enhance our existing line of ceramic and glass versions by 3rd quarter 2007. These lids will be available for all of our standard QFN, SOIC, SSOP & QFP products. We are also working on several new QFN packages that will exceed 100 leads for larger package architecture at .50 mm lead pitch. With the standardization to comply with RoHS compliant issues, Sempac will be transitioning all of its stock program to meet these requirements by years end.



QFN

SOIC

SSOP

 

Home  -   Applications  -   Products  -   New Solutions  -   News  -   Company  -   Careers  -   Contact

© 2017 SEMPAC