SEMPAC Inc. - Open-Pak� Innovative Solutions In Packaging


SEMPAC Innovative Solutions In Packaging

News & Press

SEMPAC Announces New Distributor
06-29-2007
SEMPAC Inc.

Sempac Inc, a Sunnyvale, California based manufacturer devoted to the design, development of “air-cavity” plastic packages used mainly during the prototype and test phase announces the addition of TopLine, to their distribution network.

TopLine, known in the industry for providing dummy components and practice PC boards will expand their product offering with Sempac’s QFN, SOIC, SOP and LQFP “Open-Pak” Technology plastic packages. Sempac and TopLine share in the same philosophy for low cost solutions in their respective markets and together are offering application and design engineers’ expertise and technical support.

Some of the key features and benefits of Sempac Open-Pak Packages are:

  • Ideal for Device Development for Telecom, Optoelectronic, RF MEMS and SensorDevices
  • Bring new devices for Cell Phones, PDA’s and Digital Cameras to the market quicker
  • Packages meet JEDEC Outline and Footprint, are Reliable and Low Cost
  • Ideal solution for Device Development and Die Qualification
  • Compatible with High Volume Plastic Packages

“This new partnership will ultimately establish one more quick-turn resource for design engineers. By partnering we are helping our customers with increased engineering support which will accelerate the customer’s products to the market faster…”

About Sempac

Founded in 2000 Sempac offers an innovated manufacturing technology solution for small outline integrated circuit packaging. Our products aid in the manufacturing and development of Telecommunication, Optoelectronic, RF, MEMS and Sensor devices. Our packaging technology has been used to bring new devices for Cell phones, PDA’s and Digital cameras to market quicker, by reducing development costs and allowing our customers to get new products into the market faster. For more information please visit http://www.sempac.com

About TopLine

Founded in 1989 is the world's largest provider of dummy components and practice PC boards. TopLine has helped thousands of customers define and refine their SMD assembly processes. For more information please visit http://www.topline.tv



QFN

SOIC

SSOP

 

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