SEMPAC Inc. - Open-Pak� Innovative Solutions In Packaging


SEMPAC Innovative Solutions In Packaging


 

Open-Pak™ Products :: SOIC & SSOP

SEMPAC’S line of “Open-Pak”™ SOIC’s (Small Outline IC’s) & SSOP’s (Shrink Small Outline Packages ) are offered in both a “Heat Enhanced” version that enables heat dissipation at high frequencies and standard surface mount footprints. These “solutions” feature external leads, bonding fingers and die pads that are gold plated to military standards. The leads are gull-wing formed and are available in -2- body styles (150 & 300 mils.) with varying pin counts. These packages also come with their matching ceramic or glass epoxy coated or non-coated lids.

SEMPAC’s Open-Pak™ SOIC’s & SSOP’s are also available in the Nickel Palladium (Ni/Pd) and Nickel, Palladium, Gold (Ni/Pd/Au) surface finishes. All of our products affords the packaging engineers the fastest design and delivery of packages for device development & die qualifications bringing cell phones, PDA’s and digital camera’s, to name but a few, quickly to market.

If you have applications that require customization, SEMPAC’s low cost NRE’s (non-recurring engineering) and cycle time greatly reduce the time and cost restraints associated with ceramic materials.

Please contact our sales department to discuss your application or request a quote on one of the items from our product configuration list below:

Open-Pak™ SOIC / SSOP Product Configuration List

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Body Width Lead Count Die Pad Size Lead Pitch Body Thickness JEDEC Spec  
.300 in. 20 .150X.220 in. .050 in. .093 in. MS-013  
Package Drawing
SOIC300-20-OP-01
Bonding Drawing
SOIC300-20-OP-01-B
Ceramic Lid Part No.
CL-270X400-15-01
Request Quote
.300 in. 24 .150X.220 in. .050 in. .093 in. MS-013  
Package Drawing
SOIC300-24-OP-01
Bonding Drawing
SOIC300-24-OP-01-B
Ceramic Lid Part No.
CL-270X400-15-01
Request Quote
.300 in. 28 .160X.230 in. .050 in. .093 in. MS-013  
Package Drawing
SOIC300-28-OP-01
Bonding Drawing
SOIC300-28-OP-01-B
Ceramic Lid Part No.
CL-270X400-15-01
Request Quote
.150 in. 8 .075 X .100 in. .050 in. .055 in. MS-012  
Package Drawing
SOIC150-08-OP-01H
Bonding Drawing
SOIC150-08-OP-01H-B
Ceramic Lid Part No.
CL-145X185-15-01
Request Quote

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